Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts (Q1401655)

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Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts
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    Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts (English)
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    18 August 2003
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    In the paper the in-plane problem of an interface crack between two dissimilar piezoelectric layers in the form of infinitely long strips with finite widths subjected to mechanical and electrical impacts is solved under the boundary condition of electrical insulation, using the Laplace and Fourier transforms and the Cauchy singular integral equation method. The effects of electrical loading, material combination parameters and geometric configuration on the dynamic response are examined. After obtaining the Cauchy singular integral equation of the second type and its regularization, the solution is expressed via Jacobi polynomials. By using the orthogonality relations of the Jacobi polynomials the problem is reduced to a set of algebraic equations. From these equations, applying the inverse Laplace transform method, the authors obtain the mode I and II dynamic stress intensity factors (DSIFs), the dynamic electric displacement intensity factor (DEDIF) of the right crack tip and the dynamic energy release rate (DERR). The numerical results show that the DERR seems a more appropriate parameter than the DSIF as the criterion of crack growth when the electrical load is applied, and that the electrical load and the crack configuration have influence on the DERR. Then, it is shown that a negative electrical impact loading on the crack surface is more liable to promote the crack extension than a positive one. The crack extension is retarded by the choice of the load configuration or the material configuration parameters. In comparison with elastic moduli the combination parameters of the piezoelectric coefficients exert a relatively small influence on the DERR and DEDIF. The effects of dielectric constants on the DERR can also be neglected. Finally, the electric-mechanical coupling effect in in-plane problems plays a more important role than in anti-plane ones.
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    Interface crack
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    dynamic stress intensity factor
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    electrical displacement intensity factor
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    energy release rate
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    piezoelectric material
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