Numerical simulation of laser-induced transient temperature field in film-substrate system by finite element method. (Q1430757)
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scientific article; zbMATH DE number 2067504
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| English | Numerical simulation of laser-induced transient temperature field in film-substrate system by finite element method. |
scientific article; zbMATH DE number 2067504 |
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Numerical simulation of laser-induced transient temperature field in film-substrate system by finite element method. (English)
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27 May 2004
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The authors consider the transient heat equation in cylindrical coordinates to model a pulsed laser in film-substrate system. To solve it, they use a Crank-Nicholson scheme in time and a standard finite element method in space. The temperature dependences of material properties are taken into account. As a example, the behavior of a aluminum/methyl-methacrylate system and aluminum/copper system are obtained, which can be useful in the research on thermoelastic excitation of laser ultrasonic waves in film substrate.
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heat equation
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transient temperature
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laser-material interaction
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0.7159222364425659
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0.7077154517173767
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0.7076786160469055
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