Analytical solutions of heat transfer and film thickness with slip condition effect in thin-film evaporation for two-phase flow in microchannel (Q1665495)

Summary: Physical and mathematical model has been developed to predict the two-phase flow and heat transfer in a microchannel with evaporative heat transfer. Sample solutions to the model were obtained for both analytical analysis and numerical analysis. It is assumed that the capillary pressure is neglected [\textit{S. J. S. Morris}, J. Fluid Mech. 494, 297--317 (2003; Zbl 1060.76118)]. Results are provided for liquid film thickness, total heat flux, and evaporating heat flux distribution. In addition to the sample calculations that were used to illustrate the transport characteristics, computations based on the current model were performed to generate results for comparisons with the analytical results of \textit{H. Wang} et al. [Int. J. Heat Mass Transfer 51, No. 25--26, 6317--6322 (2008; Zbl 1153.80338)] and \textit{P. C. Wayner jun.} et al. [``The interline heat-transfer coefficient of an evaporating wetting film'', ibid. 19, No. 5, 487--492 (1976; \url{doi:10.1016/0017-9310(76)90161-7})]. The calculated results from the current model match closely with those of analytical results of [Wang et al., loc. cit.] and [Wayner jun. et al., loc. cit.]. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region and develop an analytical equation for evaporating liquid film thickness.