Coping with complexity when predicting surface roughness in milling processes: hybrid incremental model with optimal parametrization (Q1693809)
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English | Coping with complexity when predicting surface roughness in milling processes: hybrid incremental model with optimal parametrization |
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Coping with complexity when predicting surface roughness in milling processes: hybrid incremental model with optimal parametrization (English)
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31 January 2018
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Summary: The complexity of machining processes relies on the inherent physical mechanisms governing these processes including nonlinear, emergent, and time-variant behavior. The measurement of surface roughness is a critical step done offline by expensive quality control procedures. The surface roughness prediction using an online efficient computational method is a difficult task due to the complexity of machining processes. The paradigm of hybrid incremental modeling makes it possible to address the complexity and nonlinear behavior of machining processes. Parametrization of models is, however, one bottleneck for full deployment of solutions, and the optimal setting of model parameters becomes an essential task. This paper presents a method based on simulated annealing for optimal parameters tuning of the hybrid incremental model. The hybrid incremental modeling plus simulated annealing is applied for predicting the surface roughness in milling processes. Two comparative studies to assess the accuracy and overall quality of the proposed strategy are carried out. The first comparative demonstrates that the proposed strategy is more accurate than theoretical, energy-based, and Taguchi models for predicting surface roughness. The second study also corroborates that hybrid incremental model plus simulated annealing is better than a Bayesian network and a multilayer perceptron for correctly predicting the surface roughness.
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complexity of machining processes
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measurement of surface roughness
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simulated annealing for optimal parameters tuning
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hybrid incremental modeling
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Bayesian network
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multilayer perceptron
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