Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging (Q2004642)
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scientific article
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| English | Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging |
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Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging (English)
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7 October 2020
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coupled problems
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de Rham currents
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electrothermal problems
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network model
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singularities
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thin wires
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0.6862913966178894
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0.6850540637969971
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0.6832208633422852
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