Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging (Q2004642)
From MaRDI portal
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging |
scientific article |
Statements
Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging (English)
0 references
7 October 2020
0 references
coupled problems
0 references
de Rham currents
0 references
electrothermal problems
0 references
network model
0 references
singularities
0 references
thin wires
0 references
0 references
0 references
0 references
0 references
