Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging

DOI10.1016/J.CAMWA.2019.10.009zbMATH Open1443.80021arXiv1809.09034OpenAlexW2985946412MaRDI QIDQ2004642FDOQ2004642

Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ulrich Römer

Publication date: 7 October 2020

Published in: Computers & Mathematics with Applications (Search for Journal in Brave)

Abstract: This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat distribution is modeled by an electrothermal coupled problem, which poses numerical challenges due to the presence of different geometric scales. The necessity of very fine grids is relaxed by solving and embedding a 1D sub-problem along the wire into the surrounding 3D geometry. The arising singularities are described using de Rham currents. It is shown that the problem is related to fluid flow in porous 3D media with 1D fractures [C. D'Angelo, SIAM Journal on Numerical Analysis 50.1, pp. 194-215, 2012]. A careful formulation of the 1D-3D coupling condition is essential to obtain a stable scheme that yields a physical solution. Elliptic model problems are used to investigate the numerical errors and the corresponding convergence rates. Additionally, the transient electrothermal simulation of a simplified microelectronic chip package as used in industrial applications is presented.

Full work available at URL: https://arxiv.org/abs/1809.09034

Recommendations

• scientific article; zbMATH DE number 1014919
• Transient numerical simulation of a thermoelectrical problem in cylindrical induction heating furnaces
• A partitioned solution approach for electro-thermo-mechanical problems
• Thermo‐electro‐mechanical coupling problems solved by FE‐formulation
• scientific article; zbMATH DE number 2110677

zbMATH Keywords

network modelsingularitiescoupled problemsthin wiresde Rham currentselectrothermal problems

Mathematics Subject Classification ID

Technical applications of optics and electromagnetic theory (78A55) Numerical methods for partial differential equations, initial value and time-dependent initial-boundary value problems (65M99) Radiative heat transfer (80A21)

Cites Work

• Galerkin Finite Element Methods for Parabolic Problems
• Error-bounds for finite element method
• Title not available (Why is that?)
• Convergence Analysis of Fully Discrete Finite Volume Methods for Maxwell's Equations in Nonhomogeneous Media
• CONVERGENCE OF MIMETIC FINITE DIFFERENCE METHOD FOR DIFFUSION PROBLEMS ON POLYHEDRAL MESHES WITH CURVED FACES
• Discrete Hodge operators
• Numerical approximation of partial differential equations
• Title not available (Why is that?)
• Title not available (Why is that?)
• Title not available (Why is that?)
• Computational Electromagnetics
• Finite element approximation of elliptic problems with Dirac measure terms in weighted spaces: applications to one- and three-dimensional coupled problems
• A Priori Mesh Grading for an Elliptic Problem with Dirac Right-Hand Side
• ON THE COUPLING OF 1D AND 3D DIFFUSION-REACTION EQUATIONS: APPLICATION TO TISSUE PERFUSION PROBLEMS
• Yee-like schemes on a tetrahedral mesh, with diagonal lumping
• Fractional step methods for index-1 differential-algebraic equations
• Mimetic discretization and higher order time integration for acoustic, electromagnetic and elastodynamic wave propagation
• de Rham currents in discrete electromagnetism
• Differential form valued forms and distributional electromagnetic sources
• Numerical Investigation of Convergence Rates for the FEM Approximation of 3D-1D Coupled Problems

Uses Software

• GitHub

This page was built for publication: Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2004642)