Coupled simulation of transient heat flow and electric currents in thin wires: application to bond wires in microelectronic chip packaging

DOI10.1016/J.CAMWA.2019.10.009MaRDI QIDQ2004642zbMATH OpenOpenAlexFDO

Authors Thorben Casper, Ulrich Römer, Herbert De Gersem, Sebastian Schöps

Publication date 7 October 2020

Published in Computers & Mathematics with Applications (Search for Journal in Brave)

Copyright license Creative Commons Attribution 4.0 International

Full work available at URL https://arxiv.org/abs/1809.09034

zbMATH Keywords

network modelsingularitiescoupled problemsthin wiresde Rham currentselectrothermal problems

Mathematics Subject Classification ID

Technical applications of optics and electromagnetic theory (78A55) Numerical methods for partial differential equations, initial value and time-dependent initial-boundary value problems (65M99) Radiative heat transfer (80A21)

Abstract: This work addresses the simulation of heat flow and electric currents in thin wires. An important application is the use of bond wires in microelectronic chip packaging. The heat distribution is modeled by an electrothermal coupled problem, which poses numerical challenges due to the presence of different geometric scales. The necessity of very fine grids is relaxed by solving and embedding a 1D sub-problem along the wire into the surrounding 3D geometry. The arising singularities are described using de Rham currents. It is shown that the problem is related to fluid flow in porous 3D media with 1D fractures [C. D'Angelo, SIAM Journal on Numerical Analysis 50.1, pp. 194-215, 2012]. A careful formulation of the 1D-3D coupling condition is essential to obtain a stable scheme that yields a physical solution. Elliptic model problems are used to investigate the numerical errors and the corresponding convergence rates. Additionally, the transient electrothermal simulation of a simplified microelectronic chip package as used in industrial applications is presented.

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