Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip (Q2985288)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip |
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Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip (English)
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16 May 2017
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