Multicast-Based Testing and Thermal-Aware Test Scheduling for 3D ICs with a Stacked Network-on-Chip

DOI10.1109/TC.2015.2493548zbMATH Open1360.68292OpenAlexW2516697505MaRDI QIDQ2985288FDOQ2985288

Authors: Dong Xiang, Krishnendu Chakrabarty, Hideo Fujiwara 

Publication date: 16 May 2017

Published in: IEEE Transactions on Computers (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1109/tc.2015.2493548

Mathematics Subject Classification ID

Performance evaluation, queueing, and scheduling in the context of computer systems (68M20)

Cited In (2)

• Exact Wirelength of Embedding 3-Ary n-Cubes into Certain Cylinders and Trees
• All-to-all broadcast in dragonfly networks

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