Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models (Q3605175)
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scientific article; zbMATH DE number 5509782
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| English | Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models |
scientific article; zbMATH DE number 5509782 |
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Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models (English)
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20 February 2009
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chip scale package
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temperature cycling
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thermal stress
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thermal strain
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finite element
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numerical simulation
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0.7198715806007385
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0.7014405131340027
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0.6974526643753052
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0.6778542995452881
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