Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS (Q400172)
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scientific article; zbMATH DE number 6333113
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| English | Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS |
scientific article; zbMATH DE number 6333113 |
Statements
Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS (English)
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21 August 2014
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adhesion
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stiction
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experiments
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finite element method
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0.79376620054245
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0.7676994800567627
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0.7614607810974121
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0.7499821782112122
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0.6792537569999695
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