Modeling of solder joint defects through a level-set approach (Q5439686)
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scientific article; zbMATH DE number 5234156
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|---|---|---|---|
| default for all languages | No label defined |
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| English | Modeling of solder joint defects through a level-set approach |
scientific article; zbMATH DE number 5234156 |
Statements
11 February 2008
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solder-joint defects
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flip-chip assembly
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levelset
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0.6982033252716064
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0.6933019757270813
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0.6583368182182312
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0.6514730453491211
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