Modeling of solder joint defects through a level-set approach

MaRDI QIDQ5439686zbMATH OpenFDO

Authors Myungjoo Kang, Susant K. Patra

Publication date 11 February 2008

zbMATH Keywords

flip-chip assemblylevelsetsolder-joint defects

Mathematics Subject Classification ID

Numerical optimization and variational techniques (65K10) Finite difference methods for initial value and initial-boundary value problems involving PDEs (65M06)

Recommendations

• Failure analysis of solder joints with a damage‐coupled viscoplastic model
• Automatic visual inspection of surface mount solder joint defects
• Solder joint lifetime assessment of electronic devices
• Process capability study and thermal fatigue life prediction of ceramic BGA solder joints
• Approximate solutions for the stresses in the solder joints of a printed circuit board subjected to mechanical bending

Cited in

(4)

• A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies
• Mechanics of microelectrics examined by design of experiments techniques
• Failure analysis of solder joints with a damage‐coupled viscoplastic model
• Automatic visual inspection of surface mount solder joint defects

This page was built for publication: Modeling of solder joint defects through a level-set approach

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q5439686)