Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend (Q629584)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend |
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Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend (English)
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9 March 2011
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Summary: Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend have been numerically simulated. Under the effect of dielectrophoretic force, gravity and Stokes force, it is found that microparticles with larger size deposit on the lower region of the bend's outer wall. An exponential curve of deposition efficiency versus the product of Stokes number and shape factor is fitted based on large number of numerical results
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