Fatigue and fracture assessment for reliability in electronics packaging (Q944280)
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scientific article; zbMATH DE number 5344001
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | No label defined |
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| English | Fatigue and fracture assessment for reliability in electronics packaging |
scientific article; zbMATH DE number 5344001 |
Statements
Fatigue and fracture assessment for reliability in electronics packaging (English)
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15 September 2008
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Creep
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Fatigue
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Electronic package
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Reliability
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Solder
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0.8587852
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0.83630985
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0.80680925
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0.8040201
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0.8022766
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0.80209494
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0.80161786
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