Failure analysis of a semiconductor packaging leadframe using the signal processing approach (Q3556846)
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scientific article; zbMATH DE number 5701793
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| English | Failure analysis of a semiconductor packaging leadframe using the signal processing approach |
scientific article; zbMATH DE number 5701793 |
Statements
FAILURE ANALYSIS OF A SEMICONDUCTOR PACKAGING LEADFRAME USING THE SIGNAL PROCESSING APPROACH (English)
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26 April 2010
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un-oxidised leadframe
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oxidised leadframe
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quad flat no-lead
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three-points cyclic bending test
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durability
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0.7225364446640015
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0.6454600095748901
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0.640476405620575
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0.6391392350196838
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0.6350724101066589
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