Failure analysis of a semiconductor packaging leadframe using the signal processing approach

DOI10.1142/S0217979210064101MaRDI QIDQ3556846zbMATH OpenOpenAlexFDO

Authors Shahrum Abdullah, Che Ku Eddy Nizwan, Mohamad Faizal Abdullah, Azman Jalar, Mohd Faridz Mod Yunoh, A. K. Ariffin

Publication date 26 April 2010

Published in International Journal of Modern Physics B (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1142/s0217979210064101

zbMATH Keywords

durabilityoxidised leadframequad flat no-leadthree-points cyclic bending testun-oxidised leadframe

Mathematics Subject Classification ID

Numerical methods for discrete and fast Fourier transforms (65T50) Statistical mechanics of semiconductors (82D37)

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Cites work

• Characterizations of dimension functions of wavelet packets
• scientific article; zbMATH DE number 430507 (Why is no real title available?)

Cited in

(2)

• Metallic interconnection technologies for high power vertical cavity surface emitting lasers modules
• Fatigue and fracture assessment for reliability in electronics packaging

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