Planar Hertz Contact With Heat Conduction
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Cited in
(8)- Plane contact problem of thermoelasticity with quasi-steady frictional heating
- Effect of temperature difference on the adhesive contact between two spheres
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
- The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems
- Separated steady state solutions for two thermoelastic half-planes in contact with out-of-plane sliding
- Boundary element method applied to three dimensional thermoelastic contact
- Adhesive behavior between dissimilar materials subjected to thermo-elastic loadings with normal-tangential coupling effect
- Multiscale thermomechanical contact: computational homogenization with isogeometric analysis
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