The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems
DOI10.1016/J.ENGANABOUND.2019.06.019zbMATH Open1464.74006OpenAlexW2969500209MaRDI QIDQ2325535FDOQ2325535
Authors: I. Ubero-Martínez, J. Vallepuga-Espinosa, J. Cifuentes-Rodríguez, Luis Rodríguez-Tembleque 
Publication date: 26 September 2019
Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.enganabound.2019.06.019
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conductionthermoelasticityboundary element methodthermomechanical contactinterstitial convective conditions
Boundary element methods for boundary value problems involving PDEs (65N38) Thermodynamics in solid mechanics (74A15) Contact in solid mechanics (74M15) Diffusive and convective heat and mass transfer, heat flow (80A19)
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Cited In (5)
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
- A note on convective effects in elastic contact problems for dissimilar materials
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions
- Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem
- A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems
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