Mechanical modeling and transient anti-plane fracture analysis for the graded inter-diffusion regions in a bonded structure

DOI10.1007/S11012-008-9175-XzbMath1198.74074OpenAlexW1989801761MaRDI QIDQ1035348

Lee, Kang Yong, Yong-Dong Li

Publication date: 2 November 2009

Published in: Meccanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s11012-008-9175-x

zbMATH Keywords

integral transformsstress intensity factorsCauchy singular integral equationweak discontinuityLobatto-Chebyshev collocation methodfunctionally-graded materials

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

Related Items (2)

Modeling method for the crack problem of a functionally graded interfacial zone with arbitrary material properties ⋮ Interface edge crack in a multiferroic semicylinder

Cites Work

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• Anti-plane shear crack in a functionally gradient piezoelectric layer bonded to dissimilar half spaces
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• The Crack Problem for Bonded Nonhomogeneous Materials Under Antiplane Shear Loading
• The Interface Crack
• Numerical Inversion of the Laplace Transform by Use of Jacobi Polynomials
• On the numerical solution of singular integral equations

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