Mode III crack problems for two bonded functionally graded piezoelectric materials
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Publication:2385289
DOI10.1016/J.IJSOLSTR.2004.10.013zbMATH Open1126.74039OpenAlexW1982423660MaRDI QIDQ2385289FDOQ2385289
Authors: Ching-Hwei Chue, Yi-Liang Ou 
Publication date: 11 October 2007
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2004.10.013
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Cited In (24)
- A mode III crack in functionally graded piezoelectric materials
- Non-local behavior of two collinear mixed-mode limited-permeable cracks in a functionally graded piezoelectric medium
- Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
- Multiple scattering of electro-elastic waves from a buried cavity in a functionally graded piezoelectric material layer
- Electro-mechanical frictionless contact behavior of a functionally graded piezoelectric layered half-plane under a rigid punch
- An anti-plane crack perpendicular to the weak/micro-discontinuous interface in a bi-FGM structure with exponential and linear non-homogeneities
- Transient anti-plane crack problem for two bonded functionally graded piezoelectric materials
- Analytical solution for an interfacial crack subjected to dynamic anti-plane shear loading
- Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
- The fracture behavior of functionally graded piezoelectric materials with dielectric cracks
- Mode III eccentric crack in a functionally graded piezoelectric strip
- Error analysis of a residual-based Galerkin's method for a system of Cauchy singular integral equations with vanishing endpoint conditions
- Effects of nonhomogeneity on singular electroelastic field near electrodes for a functionally graded piezoelectric material
- Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate
- Mode-III crack problems in a cubic piezoelectric medium
- Mode III crack problems of two bonded functionally graded strips with internal cracks
- Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane
- Fracture analysis of a weak-discontinuous interface in a symmetrical functionally gradient composite strip loaded by anti-plane impact
- Antiplane internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half-plane
- Mechanical modeling and transient anti-plane fracture analysis for the graded inter-diffusion regions in a bonded structure
- Dynamic stress of a circular cavity buried in a semi-infinite functionally graded piezoelectric material subjected to shear waves
- Mechanical modeling and fracture analysis for a non-homogeneous weldment with a crack perpendicular to the interface
- Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface
- Dynamic stress intensity factor of a crack perpendicular to the weak-discontinuous interface in a nonhomogeneous coating-substrate structure
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