Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate
DOI10.1007/S00419-009-0315-0zbMATH Open1271.74387OpenAlexW2070932767MaRDI QIDQ363052FDOQ363052
Authors: Yen-Ji Chen, Ching-Hwei Chue 
Publication date: 30 August 2013
Published in: Archive of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00419-009-0315-0
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singular integral equationFGPMGauss-Chebyshev techniqueimpermeable and permeable crackssubstratesurface layer
Electromagnetic effects in solid mechanics (74F15) Brittle fracture (74R10) Inhomogeneity in solid mechanics (74E05)
Cites Work
- Title not available (Why is that?)
- Closed-form solution for a mode-III crack at the mid-plane of a piezoelectric layer
- Mode III crack problems for two bonded functionally graded piezoelectric materials
- Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
- Antiplane Crack Problem in Functionally Graded Piezoelectric Materials
- A Mode III Crack in a Functionally Graded Piezoelectric Material Strip
Cited In (7)
- Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties
- Non-local behavior of two collinear mixed-mode limited-permeable cracks in a functionally graded piezoelectric medium
- Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
- The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane
- Surface cracking of a piezoelectric strip bonded to an elastic substrate (mode I crack problem)
- An interface crack moving between magnetoelectroelastic and functionally graded elastic layers
- Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane
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