Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate

DOI10.1007/S00419-009-0315-0MaRDI QIDQ363052zbMATH OpenOpenAlexFDO

Authors Yen-Ji Chen, Ching-Hwei Chue

Publication date 30 August 2013

Published in Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s00419-009-0315-0

zbMATH Keywords

singular integral equationFGPMGauss-Chebyshev techniqueimpermeable and permeable crackssubstratesurface layer

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15) Brittle fracture (74R10) Inhomogeneity in solid mechanics (74E05)

Recommendations

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Cites work

• scientific article; zbMATH DE number 3418756 (Why is no real title available?)
• A Mode III Crack in a Functionally Graded Piezoelectric Material Strip
• Antiplane Crack Problem in Functionally Graded Piezoelectric Materials
• Closed-form solution for a mode-III crack at the mid-plane of a piezoelectric layer
• Mode III crack problems for two bonded functionally graded piezoelectric materials
• Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively

Cited in

(7)

• Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties
• Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
• Non-local behavior of two collinear mixed-mode limited-permeable cracks in a functionally graded piezoelectric medium
• The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane
• Surface cracking of a piezoelectric strip bonded to an elastic substrate (mode I crack problem)
• An interface crack moving between magnetoelectroelastic and functionally graded elastic layers
• Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane

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