Mode III crack problems of two bonded functionally graded strips with internal cracks

DOI10.1016/J.IJSOLSTR.2008.08.031MaRDI QIDQ834422zbMATH OpenOpenAlexFDO

Authors Yen-Ji Chen, Ching-Hwei Chue

Publication date 26 August 2009

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijsolstr.2008.08.031

zbMATH Keywords

functionally graded materialsingular integral equationstress intensity factorGauss-Chebyshev technique

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

Recommendations

• Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips
• Mode III crack problems for two bonded functionally graded piezoelectric materials
• Mode-I crack problem for functionally graded layered structures
• Mode I crack problem for a functionally graded orthotropic strip
• Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane
• Mode III fracture of an arbitrary oriented crack in two dimensional functionally graded material
• The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone
• Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
• Mode III crack problem in a functionally graded magneto-electro-elastic strip
• Basic solution of two parallel mode-I cracks in functionally graded materials

Cites work

• scientific article; zbMATH DE number 3418756 (Why is no real title available?)
• Anti-plane analysis of a functionally graded strip with multiple cracks
• Anti-plane fracture of a functionally graded material strip
• Bonded dissimilar strips with a crack perpendicular to the functionally graded interface
• Mode I crack problem for a functionally graded orthotropic strip
• Propagation of an anti-plane moving crack in a functionally graded piezoelectric strip
• The Crack Problem for Bonded Nonhomogeneous Materials Under Antiplane Shear Loading
• The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone
• The Surface Crack Problem for a Plate With Functionally Graded Properties
• The general problem for an arbitrarily oriented crack in a FGM layer
• Thermal stress intensity factors for a crack in a strip of a functionally gradient material

Cited in

(13)

• Dynamic stress intensity factors of mode I crack problem for functionally graded layered structures
• Anti-plane fracture analysis of functionally gradient material infinite strip with finite width
• Dynamic mode III stress intensity factors of multiple axisymmetric interfacial cracks in an FGM coated orthotropic layer
• Anti-plane crack problem of a functionally graded piezoelectric materials strip with arbitrarily distributed properties
• Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
• Mode I crack problem for a functionally graded orthotropic strip
• Analysis of mode III crack perpendicular to the interface between two dissimilar strips
• Mode-I crack problem for functionally graded layered structures
• Anti-plane fracture of a functionally graded material strip
• Crack interactions in functionally graded/homogeneous composite bimaterials subjected to antiplane loading
• Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate
• Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips
• Mode III fracture of an arbitrary oriented crack in two dimensional functionally graded material

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