| Publication | Date of Publication | Type |
|---|
Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium
Journal of Engineering Mathematics | 2017-04-06 | Paper |
Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips
Meccanica | 2013-09-05 | Paper |
Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate
Archive of Applied Mechanics | 2013-08-30 | Paper |
Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
Meccanica | 2013-03-01 | Paper |
Mode III crack problems of two bonded functionally graded strips with internal cracks
International Journal of Solids and Structures | 2009-08-26 | Paper |
Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane
International Journal of Solids and Structures | 2009-08-26 | Paper |
Antiplane internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half-plane
Meccanica | 2009-06-30 | Paper |
Discussion of antiplane singularities of piezoelectric-dielectric and piezoelectric-conductor wedges
Archive of Applied Mechanics | 2009-05-29 | Paper |
Mode III eccentric crack in a functionally graded piezoelectric strip
International Journal of Solids and Structures | 2007-10-17 | Paper |
Erratum to ``Electro-elastic analysis of a bimaterial piezoelectric wedge with an interface crack under antiplane concentrated forces and inplane surface charges.
International Journal of Solids and Structures | 2007-10-16 | Paper |
Mode III crack problems for two bonded functionally graded piezoelectric materials
International Journal of Solids and Structures | 2007-10-11 | Paper |
Antiplane electro-mechanical field of a piezoelectric finite wedge under shear loading and at fixed-grounded boundary conditions
International Journal of Solids and Structures | 2007-10-09 | Paper |
Disappearance Conditions of Stress Singularities for Anisotropic Bimaterial Half-Plane Wedges Under Antiplane Shear
Journal of Applied Mechanics | 2007-06-01 | Paper |
Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
Archive of Applied Mechanics | 2006-09-28 | Paper |
Comments on ``Analysis of an isotropic finite wedge under antiplane deformation by M. H. Kargarnovin et al.
International Journal of Solids and Structures | 2005-10-04 | Paper |
Electro-elastic analysis of a bimaterial piezoelectric wedge with an interface crack under antiplane concentrated forces and inplane surface charges
International Journal of Solids and Structures | 2005-06-27 | Paper |
The stress singularities at the apex of composite piezo-electric junctions
Archive of Applied Mechanics | 2005-03-21 | Paper |
Singular electro-mechanical fields near the apex of a piezoelectric bonded wedge under antiplane shear.
International Journal of Solids and Structures | 2004-05-27 | Paper |
A general solution on stress singularities in an anisotropic wedge
International Journal of Solids and Structures | 2004-02-08 | Paper |
Antiplane stress singularities in a bonded bimaterial piezoelectric wedge
Archive of Applied Mechanics | 2003-08-31 | Paper |
Decoupled formulation of piezoelectric elasticity under generalized plane deformation and its application to wedge problems.
International Journal of Solids and Structures | 2003-03-11 | Paper |
