Stress analysis of finite interfacially cracked bimaterial plates by using the variational method

DOI10.1016/0045-7825(89)90110-2MaRDI QIDQ1264024zbMATH OpenOpenAlexFDO

Authors Weichung Wang, J. T. Chen

Publication date 1989

Published in Computer Methods in Applied Mechanics and Engineering (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/0045-7825(89)90110-2

zbMATH Keywords

uniaxial loadingstress distributionseigenfunction expansion variational methodInterfacial stress intensity factors

Mathematics Subject Classification ID

Plates (74K20) Brittle damage (74R05) Stress concentrations, singularities in solid mechanics (74G70)

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Cites work

• scientific article; zbMATH DE number 3084088 (Why is no real title available?)
• Partly unbonded interfaces between dissimilar materials under normal and shear loading
• Stress Distribution in a Nonhomogeneous Elastic Plane With Cracks
• The Interface Crack
• The Interface Crack in a Tension Field
• Transient Stress Intensity Factors of an Interfacial Crack Between Two Dissimilar Anisotropic Half-Spaces, Part 1: Orthotropic Materials
• Transient Stress Intensity Factors of an Interfacial Crack Between Two Dissimilar Anisotropic Half-Spaces, Part 2: Fully Anisotropic Materials

Cited in

(5)

• Stress analysis for an infinite strip weakned by periodic cracks
• Eigenfunction expansion variational method for stress intensity factor and T-stress evaluation of a circular cracked plate
• Hybrid singular element design for the bending analysis of bimaterial thin cracked plates
• A Trefftz method for evaluating the T‐stress for cracks emanating from a hole in a rectangular plate
• Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

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