Stress analysis of finite interfacially cracked bimaterial plates by using the variational method

DOI10.1016/0045-7825(89)90110-2zbMATH Open0688.73019OpenAlexW2015843539MaRDI QIDQ1264024FDOQ1264024

Authors: Weichung Wang, J. T. Chen 

Publication date: 1989

Published in: Computer Methods in Applied Mechanics and Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/0045-7825(89)90110-2

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zbMATH Keywords

uniaxial loadingstress distributionseigenfunction expansion variational methodInterfacial stress intensity factors

Mathematics Subject Classification ID

Plates (74K20) Brittle damage (74R05) Stress concentrations, singularities in solid mechanics (74G70)

Cites Work

• Title not available (Why is that?)
• The Interface Crack
• Stress Distribution in a Nonhomogeneous Elastic Plane With Cracks
• The Interface Crack in a Tension Field
• Transient Stress Intensity Factors of an Interfacial Crack Between Two Dissimilar Anisotropic Half-Spaces, Part 1: Orthotropic Materials
• Transient Stress Intensity Factors of an Interfacial Crack Between Two Dissimilar Anisotropic Half-Spaces, Part 2: Fully Anisotropic Materials
• Partly unbonded interfaces between dissimilar materials under normal and shear loading

Cited In (5)

• Stress analysis for an infinite strip weakned by periodic cracks
• Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading
• A Trefftz method for evaluating the T‐stress for cracks emanating from a hole in a rectangular plate
• Hybrid singular element design for the bending analysis of bimaterial thin cracked plates
• Eigenfunction expansion variational method for stress intensity factor and T-stress evaluation of a circular cracked plate

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