Stable crack growth along a brittle/ductile interface. II: Small scale yielding solutions and interfacial toughness predictions

DOI10.1016/S0020-7683(97)00270-9MaRDI QIDQ1302980zbMATH OpenOpenAlexWikidataFDO

Authors V. Pereyra

Publication date 7 August 2000

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0020-7683(97)00270-9

zbMATH Keywords

asymptotic solutionsboundary value problembrittle/ductile interfacedisplacement-based finite element methodlinear strain hardeningplastic stress intensity factorsmall scale yielding conditions

Mathematics Subject Classification ID

Brittle fracture (74R10) Anelastic fracture and damage (74R20) Finite element methods applied to problems in solid mechanics (74S05)

Review text

We consider the problem of crack growing steadily and quasi-statically along a brittle/ductile interface under plane strain, mixed mode, and small scale yielding conditions. The ductile material is characterized by the \(J_2\)-flow theory of plasticity with linear strain hardening, while the brittle material is linearly elastic. A displacement-based finite element method, exploiting the convective nature of the problem, is utilized to solve the corresponding boundary value problem. In part I of this work [\textit{P. Ponte Castañeda} and \textit{P. A. Mataga}, ibid. 27, 105-133 (1991)], we investigated the asymptotic problem. This paper addresses the full-field problem in order to validate the asymptotic solutions, and to explore the physical implications of the results. The numerical full-field results are found to be in good agreement with the analytical asymptotic solutions.

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Cited in

(4)

• The influence of plasticity on mixed mode interface toughness
• Energy rates and crack stability in small scale yielding
• The asymptotic structure of small-scale yielding interfacial free-edge joint and crack-tip fields
• Near-tip fields for quasi-static crack growth along the interface between a porous-ductile material and a rigid substrate.

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