Kinetics of crack initiation and growth in organic-containing integrated structures

DOI10.1016/J.JMPS.2003.09.022MaRDI QIDQ1434571zbMATH OpenOpenAlexFDO

Authors S. Rajasekar

Publication date 12 July 2004

Published in Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.jmps.2003.09.022

Mathematics Subject Classification ID

Materials of strain-rate type and history type, other materials with memory (including elastic materials with viscous damping, various viscoelastic materials) (74D99) Thin films (74K35) Anelastic fracture and damage (74R20)

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Cites work

• A finite element method for crack growth without remeshing
• Crack patterns in thin films
• Cracking in thin multi-layers with finite-width and periodic architectures.
• Dynamic Fracture Mechanics
• Evolving crack patterns in thin films with the extended finite element method.
• scientific article; zbMATH DE number 653085 (Why is no real title available?)
• scientific article; zbMATH DE number 1014911 (Why is no real title available?)
• scientific article; zbMATH DE number 3341067 (Why is no real title available?)
• Mixed Mode Cracking in Layered Materials
• Plastic ratcheting induced cracks in thin film structures
• The mechanics of electronic materials

Cited in

(2)

• Influence of interfacial delamination on channel cracking of elastic thin films
• Study of delayed creep fracture initiation and propagation based on semi-analytical fractional model

Describes a project that uses

Uses Software

• Dynaflow

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