Kinetics of crack initiation and growth in organic-containing integrated structures

DOI10.1016/J.JMPS.2003.09.022zbMath1041.74537OpenAlexW2029807629MaRDI QIDQ1434571

S. Rajasekar

Publication date: 12 July 2004

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.jmps.2003.09.022

Mathematics Subject Classification ID

Anelastic fracture and damage (74R20) Thin films (74K35) Materials of strain-rate type and history type, other materials with memory (including elastic materials with viscous damping, various viscoelastic materials) (74D99)

Related Items (2)

Influence of interfacial delamination on channel cracking of elastic thin films ⋮ Study of delayed creep fracture initiation and propagation based on semi-analytical fractional model

Uses Software

• Dynaflow

Cites Work

• Unnamed Item
• Unnamed Item
• Unnamed Item
• Evolving crack patterns in thin films with the extended finite element method.
• Cracking in thin multi-layers with finite-width and periodic architectures.
• Plastic ratcheting induced cracks in thin film structures
• Crack patterns in thin films
• The mechanics of electronic materials
• Dynamic Fracture Mechanics
• Mixed Mode Cracking in Layered Materials
• A finite element method for crack growth without remeshing

This page was built for publication: Kinetics of crack initiation and growth in organic-containing integrated structures