Atomistic simulations on the tensile debonding of an aluminum-silicon interface.

DOI10.1016/S0022-5096(99)00086-1MaRDI QIDQ1582441zbMATH OpenOpenAlexWikidataFDO

Authors Ken Gall, Mark Van Schilfgaarde, M. I. Baskes, Mark F. Horstemeyer

Publication date 2000

Published in Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0022-5096(99)00086-1

Mathematics Subject Classification ID

Theories of fracture and damage (74A45) Structured surfaces and interfaces, coexistent phases (74A50) Micromechanical theories (74A60)

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Cites work

• scientific article; zbMATH DE number 3072960 (Why is no real title available?)
• A Continuum Model for Void Nucleation by Inclusion Debonding
• Analytical derivation and investigation of the interface crack models
• Computational modelling of impact damage in brittle materials
• Crack deflection at an interface between dissimilar elastic materials: Role of residual stresses
• Effect on interfacial compliance on bifurcation of a layer bonded to a substrate
• Numerical modeling of crack growth under dynamic loading conditions
• Stability of solids with interfaces
• The elastic field outside an ellipsoidal inclusion
• The relation between crack growth resistance and fracture process parameters in elastic-plastic solids

Cited in

(5)

• Molecular-dynamics simulation-based cohesive zone representation of intergranular fracture processes in aluminum
• Atomistic simulations of Bauschinger effects of metals with high angle and low angle grain boundaries
• Statistical volume element method for predicting microstructure-constitutive property relations
• A comparative study of fracture in Al: quantum mechanical vs. empirical atomistic description
• Dynamic phenomena and crack propagation in dissimilar elastic lattices

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