The two-dimensional heat transfer analysis in arrayed fins with the thermal dissipation substrate
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Publication:1666419
DOI10.1155/2015/716352zbMATH Open1394.80006OpenAlexW2058185961WikidataQ59119019 ScholiaQ59119019MaRDI QIDQ1666419FDOQ1666419
Authors: Haiping Hu
Publication date: 27 August 2018
Published in: Mathematical Problems in Engineering (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1155/2015/716352
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