On pressing of a buckled film

DOI10.1016/0307-904X(95)00031-EMaRDI QIDQ1900587zbMATH OpenWikidataFDO

Authors L. B. Kublanov, William J. Bottega

Publication date 3 June 1996

Published in Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/0307-904X(95)00031-E

zbMATH Keywords

snap-through effectvon Kármán's thin plate

Mathematics Subject Classification ID

Bifurcation and buckling (74G60) Control, switches and devices (``smart materials) in solid mechanics (74M05) Fracture and damage (74R99)

Review text

The paper deals with the buckling of a thin elastic film debonded from the deformable substrate. This segment is modeled as a von Kármán's thin plate clamped at the boundary with prescribed initial displacement. The analytical solution is analyzed numerically, and it is found that the force controlling pressing leads to a snap-through effect. When deflection is controlled, the film deflects in a stable manner.

Recommendations

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Cites work

• A growth law for propagation of arbitrary shaped delaminations in layered plates
• Axisymmetric buckling and growth of a circular delamination in a compressed laminate
• Buckling of eccentrically stiffened cylinders under torsion.
• Delamination Buckling and Growth in Laminates
• Dynamics of delamination buckling
• Energy balance and the speed of crack growth in a compressed plate with delamination
• On circumferential splitting of a laminated cylindrical shell
• On pressing of a buckled film
• On the separation of concentric elastic rings
• One dimensional modelling of failure in laminated plates by delamination buckling
• Ultimate axial load capacity of a delaminated beam-plate

Cited in

(6)

• Deformation and stability of a spatial elastica under a midpoint force
• On pressing of a buckled film
• Combined effect of pressure and geometric imperfection on buckling of stressed thin films on substrates
• A simplified analysis on buckling of stressed and pressurized thin films on substrates
• Snapping of an elastica under various loading mechanisms
• In-plane displacements in thin-film blistering

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