Closed form vs. finite element analysis of laminated stacks

DOI10.1016/S0168-874X(99)00012-8MaRDI QIDQ1960437zbMATH OpenOpenAlexWikidataFDO

Authors Cemal Basaran, Ying Zhao

Publication date 12 January 2000

Published in Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0168-874x(99)00012-8

zbMATH Keywords

bi-materialclosed-form solutionsconstitutive modeldamage mechanicsdamage metricelastic analysiselectronic packagingfinite element analysisinelastic analysismesh sensitivitymulti-layered stacksstress singularitythermodynamic internal state variable

Mathematics Subject Classification ID

Thermodynamics in solid mechanics (74A15) Composite and mixture properties (74E30) Thermal effects in solid mechanics (74F05) Fracture and damage (74R99) Finite element methods applied to problems in solid mechanics (74S05)

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Cited in

(2)

• Applications of FEM for multiple laminated structure in electronic packaging
• Steady and unsteady thermal analysis of a triple stack cold plate with heat losses

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