Applications of FEM for multiple laminated structure in electronic packaging

DOI10.1016/S0168-874X(98)00030-4MaRDI QIDQ1274174zbMATH OpenOpenAlexFDO

Authors Juhachi Oda, Jiro Sakamoto

Publication date 12 January 1999

Published in Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0168-874x(98)00030-4

zbMATH Keywords

basic IC modelelectronic printed board with solder bump jointsIC model with lead fingers

Mathematics Subject Classification ID

Composite and mixture properties (74E30) Finite element methods applied to problems in solid mechanics (74S05) Technical applications of optics and electromagnetic theory (78A55)

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Cited in

(4)

• Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages
• Closed form vs. finite element analysis of laminated stacks
• The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure
• Applications of finite element methods for reliability studies on ULSI interconnections.

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