Thermal analysis of electronic packaging structure using isogeometric boundary element method

DOI10.1016/J.ENGANABOUND.2021.04.008MaRDI QIDQ2040778zbMATH OpenOpenAlexFDO

Authors Huiping Yu, Yubo Guo, Y. P. Gong, Fei Qin

Publication date 14 July 2021

Published in Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.enganabound.2021.04.008

zbMATH Keywords

electronic packaging structureIGABEMmulti-scale property of geometrynearly singular integralsradial integration method

Mathematics Subject Classification ID

Numerical analysis (65-XX) Mechanics of deformable solids (74-XX)

Recommendations

• Isogeometric boundary element method for steady-state heat transfer with concentrated/surface heat sources
• BEM calculation of the complex thermal impedance of microelectronic devices
• Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures
• Isogeometric boundary element for analyzing steady-state heat conduction problems under spatially varying conductivity and internal heat source
• RI-IGABEM in inhomogeneous heat conduction problems

Cites work

• A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging
• A general algorithm for evaluating nearly singular integrals in anisotropic three-dimensional boundary element analysis
• A locally refined adaptive isogeometric analysis for steady-state heat conduction problems
• A meshless BEM for isotropic heat conduction problems with heat generation and spatially varying conductivity
• A two-dimensional isogeometric boundary element method for elastostatic analysis
• An isogeometric boundary element method for 3D lifting flows using T-splines
• Complete polynomial expansion of domain variables at boundary for two-dimensional elasto-plastic problems
• Efficient simulation of inclusions and reinforcement bars with the isogeometric boundary element method
• Higher order B-spline collocation at the Greville abscissae
• scientific article; zbMATH DE number 981250 (Why is no real title available?)
• scientific article; zbMATH DE number 1745906 (Why is no real title available?)
• Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures
• Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures
• Impact of heat source on combined convection flow inside wavy-walled cavity filled with nanofluids via heatline concept
• Isogeometric analysis: CAD, finite elements, NURBS, exact geometry and mesh refinement
• Isogeometric boundary element method for steady-state heat transfer with concentrated/surface heat sources
• Isogeometric dual reciprocity boundary element method for solving transient heat conduction problems with heat sources
• Isogeometric symmetric FE-BE coupling method for acoustic-structural interaction
• Modeling of laser heating of bi-layered microdomain using the general boundary element method
• Numerical simulation of heat transport in multilayered composite pipe
• Shape optimization by conventional and extended isogeometric boundary element method with PSO for two-dimensional Helmholtz acoustic problems
• Singularities in anisotropic steady-state heat conduction using a boundary element method
• The multiple Reciprocity boundary element method in elasticity: A new approach for transforming domain integrals to the boundary
• The radial integration method for evaluation of domain integrals with boundary-only discretization.
• Three-dimensional analysis of heat conduction in anisotropic composites with thin adhesive/interstitial media by the boundary element method

Cited in

(6)

• Applications of FEM for multiple laminated structure in electronic packaging
• BEM calculation of the complex thermal impedance of microelectronic devices
• An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources
• The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure
• Steady heat transfer analysis for anisotropic structures using the coupled IGA-EFG method
• Isogeometric methods for thermal analysis with spatially varying thermal conductivity under general boundary and other constraints

Describes a project that uses

Uses Software

• BEMECH

This page was built for publication: Thermal analysis of electronic packaging structure using isogeometric boundary element method

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2040778)