BEM calculation of the complex thermal impedance of microelectronic devices

DOI10.1016/j.enganabound.2006.09.010zbMath1195.80032MaRDI QIDQ1958304

Gilbert De Mey, Bjorn Vermeersch

Publication date: 28 September 2010

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://biblio.ugent.be/publication/361351

zbMATH Keywords

Green's function; boundary element method; heat transfer; microelectronics; Nyquist plot; phasor notation; thermal impedance

Mathematics Subject Classification ID

80M15: Boundary element methods applied to problems in thermodynamics and heat transfer

Related Items

BEM calculation of the complex thermal impedance of microelectronic devices, The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure, A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging

Cites Work

• A formulation of the boundary element method for axisymmetric transient heat conduction
• 2D and 3D transient heat conduction analysis by BEM via particular integrals
• Transient heat conduction in homogeneous and non-homogeneous materials by the Laplace transform Galerkin boundary element method
• Dual reciprocity BEM without matrix inversion for transient heat conduction
• BEM calculation of the complex thermal impedance of microelectronic devices
• Three-dimensional singular boundary elements for corner and edge singularities in potential problems
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