An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

From MaRDI portal
Publication:2109682

DOI10.1016/J.APM.2022.03.047zbMATH Open1505.80004OpenAlexW4226497820WikidataQ113880201 ScholiaQ113880201MaRDI QIDQ2109682FDOQ2109682


Authors: Y. P. Gong, Fei Qin, Chunying Dong, J. Trevelyan Edit this on Wikidata


Publication date: 21 December 2022

Published in: Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.apm.2022.03.047







Cites Work


Cited In (3)





This page was built for publication: An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2109682)