Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures

DOI10.1016/j.cma.2020.113099zbMath1442.74249OpenAlexW3022273377MaRDI QIDQ2186857

Yanpeng Gong, G. Hattori, Chunying Dong, Fei Qin, Jon Trevelyan

Publication date: 10 June 2020

Published in: Computer Methods in Applied Mechanics and Engineering (Search for Journal in Brave)

Full work available at URL: http://dro.dur.ac.uk/30702/1/30702.pdf

zbMATH Keywords

boundary element methodisogeometric analysisthermoelastic problemcoatings/thin structuresurface nearly singular integrals

Mathematics Subject Classification ID

Numerical computation using splines (65D07) Boundary element methods applied to problems in solid mechanics (74S15) Numerical integration (65D30) Boundary element methods for boundary value problems involving PDEs (65N38) Isogeometric methods applied to problems in solid mechanics (74S22)

Related Items (13)

The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure ⋮ A semi-analytical treatment for nearly singular integrals arising in the isogeometric boundary element method-based solutions of 3D potential problems ⋮ Isogeometric FE-BE method with non-conforming coupling interface for solving elasto-thermoviscoelastic problems ⋮ On uniform convergence of approximations of the double layer potential near the boundary of a two-dimensional domain ⋮ Non-conforming coupling RI-IGABEM for solving multidimensional and multiscale thermoelastic-viscoelastic problems ⋮ BINN: a deep learning approach for computational mechanics problems based on boundary integral equations ⋮ RI-IGABEM in inhomogeneous heat conduction problems ⋮ Mixed dimensional isogeometric FE-be coupling analysis for solid-shell structures ⋮ Non-conforming interface coupling and symmetric iterative solution in isogeometric FE-BE analysis ⋮ Quadrature formulas based on spline quasi-interpolation for hypersingular integrals arising in IgA-SGBEM ⋮ Thermal analysis of electronic packaging structure using isogeometric boundary element method ⋮ Isogeometric boundary element analysis based on UE-splines ⋮ An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Uses Software

• BEMECH

Cites Work

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