Singular elastic field induced by a rigid line adhering to a micro/nanoscale plate during bending
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Publication:2109634
DOI10.1016/J.APM.2022.04.004zbMATH Open1503.74074OpenAlexW4223627615MaRDI QIDQ2109634FDOQ2109634
Authors: Zhen-Liang Hu, Ying Yang, Xian-Fang Li
Publication date: 21 December 2022
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2022.04.004
Cites Work
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- Surface stress in solids
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- Thin rigid inclusions with delaminations in elastic plates
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- Surface stress effects on the free vibration behavior of nanoplates
- Thin plate theory including surface effects
- Size-dependent bending of thin metallic films
- On the mechanics of Kirchhoff and Mindlin plates incorporating surface energy
- In-plane stress analysis of dissimilar materials with multiple interface cracks
- Transient response of cracked nonhomogeneous substrate with piezoelectric coating by dislocation method
- A rigid line inclusion in an elastic film with surface elasticity
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