In-plane stress analysis of dissimilar materials with multiple interface cracks
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Publication:2293485
DOI10.1016/J.APM.2016.05.006zbMATH Open1471.74005OpenAlexW2395491155MaRDI QIDQ2293485FDOQ2293485
Authors: Yanyan Li 
Publication date: 5 February 2020
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2016.05.006
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Cites Work
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- The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane
- Evaluation of mixed mode stress intensity factors for interface cracks using EFGM
- Analysis of stress intensity factor in orthotropic bi-material mixed interface crack
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- Dynamic stress intensity factor for cracked functionally graded orthotropic medium under time-harmonic loading
- A cracked sliding interface between anisotropic bimaterials.
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- The Interface Crack Behavior in Dissimilar Anisotropic Composites Under Mixed-Mode Loading
- Investigation of the behavior of a Griffith crack at the interface of a layer bonded to a half plane using the Schmidt method for the opening crack mode
Cited In (21)
- A Nitsche type method for stress fields calculation in dissimilar material with interface crack
- Stress intensity factor for bonded dissimilar materials weakened by multiple cracks
- In-plane transient analysis of two dissimilar nonhomogeneous half-planes containing several interface cracks
- Singular elastic field induced by a rigid line adhering to a micro/nanoscale plate during bending
- On the stress functions for the stress field around an interface crack between dissimilar materials
- Dynamic mode III stress intensity factors of multiple axisymmetric interfacial cracks in an FGM coated orthotropic layer
- Multiple unequal cracks between a functionally graded piezoelectric layer and a piezoelectric substrate by distributed strain nuclei
- Interaction among interface, multiple cracks and dislocations
- Anti-plane stress analysis of a half-plane with multiple cracks by distributed dislocation technique in nonlocal elasticity
- An asymptotic finite plane deformation analysis of the elastostatic fields at a crack tip in the framework of hyperelastic, isotropic, and nearly incompressible neo-Hookean materials under mode-i loading
- Elastic and plastic stress analysis of an interface crack between two dissimilar layers
- Non-Fourier thermal fracture analysis of a Griffith interface crack in orthotropic functionally graded coating/substrate structure
- In-plane stress analysis of an orthotropic plane containing multiple defects
- Boundary element analysis of the stress intensity factors of plane interface cracks between dissimilarly adjoined anisotropic materials
- Effect of residual stresses on the propagation of interface cracks between dissimilar brittle materials: contribution of two and three-dimensional analyses
- Effect of nonlocality and memory responses in the thermoelastic problem with a Mode I crack
- Equivalent configurational stress to predict material yielding and crack propagation
- Elastic and plastic fracture analysis of a crack perpendicular to an interface between dissimilar materials
- On interface dislocations between dissimilar materials with non-linear stress-strain laws (mode 3 analysis)
- Mixed-mode stress intensity factors for cracks located at or parallel to the interface in bimaterial half-planes
- Computational Science - ICCS 2004
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