Non-Fourier thermal fracture analysis of a Griffith interface crack in orthotropic functionally graded coating/substrate structure
DOI10.1016/J.APM.2021.12.006zbMATH Open1505.74193OpenAlexW4200288573MaRDI QIDQ2109833FDOQ2109833
Authors: Wenzhi Yang, Amin Pourasghar, Zengtao Chen 
Publication date: 21 December 2022
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2021.12.006
integral transforminterface cracksingular integral equationdual-phase-lag theorythermal stress intensity factororthotropic functionally graded coating
Cites Work
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- Thermo-mechanical behavior of a viscoelastic FGMs coating containing an interface crack
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- Nonlinear free vibration of a functionally graded nanobeam using nonlocal strain gradient theory and a novel Hamiltonian approach
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- 3D free vibration analysis of multi-directional FGM parallelepipeds using the quadrature element method
- The fractional Kelvin-Voigt model for circumferential guided waves in a viscoelastic FGM hollow cylinder
- Several embedded cracks in a functionally graded piezoelectric strip under dynamic loading
- Multiple Surface Cracking and Its Effect on Interface Cracks in Functionally Graded Thermal Barrier Coatings Under Thermal Shock
- In-plane stress analysis of dissimilar materials with multiple interface cracks
- Transient response of cracked nonhomogeneous substrate with piezoelectric coating by dislocation method
- Thermoelastic analysis of a partially insulated crack in a strip under thermal impact loading using the hyperbolic heat conduction theory
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Cited In (4)
- A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply
- Fracture analysis of Griffith interface crack in fine-grained piezoelectric coating/substrate under thermal loading
- Determination of thermal stress intensity factors for an interface crack in a graded orthotropic coating-substrate structure
- A peridynamic model for non-Fourier heat transfer in orthotropic plate with uninsulated cracks
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