A meshless collocation scheme for inverse heat conduction problem in three-dimensional functionally graded materials

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Publication:2191575

DOI10.1016/j.enganabound.2020.02.001zbMath1464.74373OpenAlexW3006769825MaRDI QIDQ2191575

Chia-Ming Fan, Yan Gu, Wen Hu

Publication date: 25 June 2020

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.enganabound.2020.02.001




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