A boundary-type meshless solver for transient heat conduction analysis of slender functionally graded materials with exponential variations

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Publication:2334886

DOI10.1016/j.camwa.2018.05.017zbMath1430.65009OpenAlexW2807468007WikidataQ115580762 ScholiaQ115580762MaRDI QIDQ2334886

Yanyan Li

Publication date: 8 November 2019

Published in: Computers \& Mathematics with Applications (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.camwa.2018.05.017




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