Investigation of a crack situated in a thin adhesive layer between two different isotropic materials
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Publication:2356458
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Cites work
- A Continuum Model for Void Nucleation by Inclusion Debonding
- Analysis of pre-fracture zones for an electrically permeable crack in an interlayer between piezoelectric materials
- Cohesive zone modeling of crack nucleation at bimaterial corners
- Electro-mechanical pre-fracture zones for an electrically permeable interface crack in a piezoelectric bimaterial
- Electro-mechanical yielding for a limited permeable crack in an interlayer between piezoelectric materials
- scientific article; zbMATH DE number 3201302 (Why is no real title available?)
- Mechanical and electrical yielding for an electrically insulated crack in an interlayer between piezoelectric materials
- Plastic stress-strain fields and limit loads of a plane strain cracked tensile panel with a mispatched welded joint
- The Effect of Self-Assembled Monolayers on Interfacial Fracture
- The influence of plasticity on mixed mode interface toughness
- The Leonov—Panasyuk—Dugdale model for a crack at the interface of the joint of materials
- The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
Cited in
(10)- Finite element analysis of interfacial crack propagation based on local shear. I: Near tip deformation; II: Fracture
- Details of the integral equation method applied to the analysis of an adhesive layer crack
- Mode III near and far fields for a crack lying in or along a joint
- A crack between orthotropic materials with a shear yield zone at the crack tip
- Analysis of a crack in a thin adhesive layer between orthotropic materials: an application to composite interlaminar fracture toughness test
- scientific article; zbMATH DE number 3980689 (Why is no real title available?)
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- Investigation of pre-fracture zones of a crack in an adhesive layer which connects isotropic materials
- Wedging of the subinterface crack by plastic cladding
- Review on interpretations, applications, and developments of numerical methods in studying interface fracture
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