Vapor pressure and residual stress effects on failure of an adhesive film

DOI10.1016/J.IJSOLSTR.2005.01.012zbMATH Open1119.74545OpenAlexW2061533707MaRDI QIDQ2385877FDOQ2385877

Authors: Yanyan Li 

Publication date: 15 October 2007

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2005.01.012

Recommendations

• Vapor pressure and residual stress effects on mixed mode toughness of an adhesive film
• Vapor pressure and void size effects on failure of a constrained ductile film
• Thermal-mechanical interface crack behaviour of a surface mount solder joint
• Pressure-sensitive ductile layers. I: Modeling the growth of extensive damage
• Pressure-sensitive ductile layers. II: 3D models of extensive damage

zbMATH Keywords

porous materialdamagepolymersadhesivevoid growthFracture mechanisms

Mathematics Subject Classification ID

Fluid-solid interactions (including aero- and hydro-elasticity, porosity, etc.) (74F10) Thin films (74K35) Brittle fracture (74R10)

Cited In (4)

• Vapor pressure and residual stress effects on mixed mode toughness of an adhesive film
• Cohesive zone laws for void growth. II: Numerical field projection of elasto-plastic fracture processes with vapor pressure
• Mode mixity and nonlinear viscous effects on toughness of interfaces
• Vapor pressure and void size effects on failure of a constrained ductile film

This page was built for publication: Vapor pressure and residual stress effects on failure of an adhesive film

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2385877)