Mixed-mode singularity and temperature effects on dislocation nucleation in strained interconnects

DOI10.1016/J.IJSOLSTR.2011.01.001zbMATH Open1236.74067OpenAlexW2061652321WikidataQ60150721 ScholiaQ60150721MaRDI QIDQ2428366FDOQ2428366

Authors: Jin Haeng Lee, Yanfei Gao 

Publication date: 24 April 2012

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2011.01.001

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zbMATH Keywords

activation energydislocation nucleationstrained electronics

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Junctions (74K30) Stress concentrations, singularities in solid mechanics (74G70)

Cites Work

• Title not available (Why is that?)
• Thin Film Materials
• Mixed Mode Cracking in Layered Materials
• The activation energy for dislocation nucleation at a crack
• Delamination mechanism maps for a strong elastic coating on an elastic-plastic substrate subjected to contact loading
• A Peierls perspective on mechanisms of atomicfriction
• Split singularities and the competition between crack penetration and debond at a bimaterial interface
• Analysis of dislocation nucleation from a crystal surface based on the Peierls--Nabarro dislocation model.
• Micro-plasticity of surface steps under adhesive contact. I: Surface yielding controlled by single-dislocation nucleation
• Micro-plasticity of surface steps under adhesive contact. II: Multiple-dislocation mediated contact hardening

Cited In (1)

• Indentation Schmid factor and orientation dependence of nanoindentation pop-in behavior of NiAl single crystals

Uses Software

• ABAQUS

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