Fracture and debonding of a thin film on a stiff substrate: analytical and numerical solutions of a one-dimensional variational model

DOI10.1007/s00161-012-0245-xzbMath1343.74032OpenAlexW2151433902WikidataQ58203999 ScholiaQ58203999MaRDI QIDQ304135

Blaise Bourdin, Andrés Alessandro León Baldelli, Jean-Jacques Marigo, Corrado Maurini

Publication date: 23 August 2016

Published in: Continuum Mechanics and Thermodynamics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00161-012-0245-x

zbMATH Keywords

fractureenergy minimizationvariational approachdelaminationthin films

Mathematics Subject Classification ID

Brittle fracture (74R10) Energy minimization in equilibrium problems in solid mechanics (74G65) Thin films (74K35)

Related Items (9)

The mathematics of thin structures ⋮ On the asymptotic derivation of Winkler-type energies from 3D elasticity ⋮ Beyond the classical Cauchy-Born rule ⋮ A variational model for fracture and debonding of thin films under in-plane loadings ⋮ A homogenization result for interacting elastic and brittle media ⋮ Validation simulations for the variational approach to fracture ⋮ Phase-field modeling of anisotropic brittle fracture including several damage mechanisms ⋮ A unified model for stress-driven rearrangement instabilities ⋮ Damage evolution and debonding in hybrid laminates with a cohesive interfacial law

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