A method for automatic inspection of printed circuit boards
From MaRDI portal
Publication:3136099
Recommendations
- Non-referential, self-compared shape defect inspection for bond pads with deformed shapes
- scientific article; zbMATH DE number 1712380
- Automatic visual inspection of surface mount solder joint defects
- scientific article; zbMATH DE number 1708117
- A method for vertex recognition in an automated vision system
Cited in
(9)- Improved PCB inspection: computational issues
- scientific article; zbMATH DE number 2043403 (Why is no real title available?)
- Some new analogic CNN algorithms for PCB quality control
- Non-referential, self-compared shape defect inspection for bond pads with deformed shapes
- scientific article; zbMATH DE number 1708117 (Why is no real title available?)
- scientific article; zbMATH DE number 1712380 (Why is no real title available?)
- Ball grid array (BGA) substrate conduct paths inspection using two-dimensional wavelet transform
- Automated inspection of IC wafer contamination
- Reference architecture for open and integrated automatic optical inspection systems
This page was built for publication: A method for automatic inspection of printed circuit boards
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q3136099)