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Automatic visual inspection of surface mount solder joint defects

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Publication:4496972
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DOI10.1080/002075499191229zbMATH Open0948.90504OpenAlexW1975412905MaRDI QIDQ4496972FDOQ4496972

O. Oyeleye, E. Amine Lehtihet

Publication date: 21 August 2000

Published in: International Journal of Production Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1080/002075499191229




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Mathematics Subject Classification ID

Production models (90B30)



Cited In (3)

  • A method for automatic inspection of printed circuit boards
  • Title not available (Why is that?)
  • Automated inspection of IC wafer contamination





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