A novel approach to hedge and compensate the critical dimension variation of the developed-and-etched circuit patterns for yield enhancement in semiconductor manufacturing

DOI10.1016/J.COR.2014.05.009zbMATH Open1348.90439OpenAlexW2068395870MaRDI QIDQ337307FDOQ337307

Authors: Chen-Fu Chien, Ying-Jen Chen, Chia-Yu Hsu 

Publication date: 10 November 2016

Published in: Computers \& Operations Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.cor.2014.05.009

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zbMATH Keywords

critical dimensionfeed-forward controlmanufacturing intelligencerun-to-run (R2R)tool affinitytool dispatchingyield enhancement

Mathematics Subject Classification ID

Programming involving graphs or networks (90C35) Case-oriented studies in operations research (90B90) Production models (90B30)

Cites Work

• Title not available (Why is that?)
• Heuristic scheduling of jobs on parallel batch machines with incompatible job families and unequal ready times
• Rule-based scheduling in wafer fabrication with due date-based objectives
• A novel timetabling algorithm for a furnace process for semiconductor fabrication with constrained waiting and frequency-based setups
• Constructing the OGE for promoting tool group productivity in semiconductor manufacturing
• Multiple-objective scheduling and real-time dispatching for the semiconductor manufacturing system

Cited In (1)

• Optimization of manufacturing of emitter-coupled logic to decrease surface of chip

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