Estimation of thermal resistance distributions for die-attach testing in microelectronics

DOI10.1080/17415970701198431zbMATH Open1157.80392OpenAlexW2033327215MaRDI QIDQ3604084FDOQ3604084

Authors: V. Feuillet, Yvon Jarny, Y. Scudeller 

Publication date: 24 February 2009

Published in: Inverse Problems in Science and Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1080/17415970701198431

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zbMATH Keywords

Defect detectionDistribution estimationInverse heat conductionMicroelectronics

Mathematics Subject Classification ID

Inverse problems in thermodynamics and heat transfer (80A23)

Cites Work

• Refinement and coarsening indicators for adaptive parametrization: application to the estimation of hydraulic transmissivities
• A Multiresolution Method for Distributed Parameter Estimation

Cited In (4)

• Inverse determination of surface temperature in thin-film/substrate systems with interface thermal resistance
• Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology
• Estimating thermal contact resistance using sensitivity analysis and regularization
• Estimation of thermal contact resistance in fin-tube heat exchanger using inverse heat transfer methods

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