Estimation of thermal resistance distributions for die-attach testing in microelectronics

DOI10.1080/17415970701198431MaRDI QIDQ3604084zbMATHOpenAlexFDO

Authors V. Feuillet, Yvon Jarny, Y. Scudeller

Publication date 24 February 2009

Published in Inverse Problems in Science and Engineering (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1080/17415970701198431

zbMATH Keywords

Defect detectionDistribution estimationInverse heat conductionMicroelectronics

Mathematics Subject Classification ID

Inverse problems in thermodynamics and heat transfer (80A23)

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Cites work

• A Multiresolution Method for Distributed Parameter Estimation
• Refinement and coarsening indicators for adaptive parametrization: application to the estimation of hydraulic transmissivities

Cited in

(4)

• Estimating thermal contact resistance using sensitivity analysis and regularization
• Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology
• Inverse determination of surface temperature in thin-film/substrate systems with interface thermal resistance
• Estimation of thermal contact resistance in fin-tube heat exchanger using inverse heat transfer methods

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