Improved tri-layered interfacial stress model with the effect of different temperatures in the layers

DOI10.1007/S00419-010-0437-4zbMATH Open1271.74055OpenAlexW2041110856MaRDI QIDQ363442FDOQ363442

Authors: D. Sujan, M. V. V. Murthy, Kankanhalli N. Seetharamu 

Publication date: 2 September 2013

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-010-0437-4

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zbMATH Keywords

different uniform temperature modelelectronic packagingexponent parameterlinear temperature gradientpeeling stressshearing stresstri-layered model

Mathematics Subject Classification ID

Composite and mixture properties (74E30) Thermal effects in solid mechanics (74F05)

Cited In (5)

• Modulation of heat flux and thermal stress at the double interface by nano-coating thickness
• Analysis of interfacial thermal stresses of chip-substrate structure
• Delamination in patterned films
• Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies
• On a simple shell model for thin structures with functionally graded materials

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