Delamination in patterned films
From MaRDI portal
Recommendations
- Influence of interfacial delamination on channel cracking of elastic thin films
- Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
- Improved tri-layered interfacial stress model with the effect of different temperatures in the layers
- Cracking in thin multi-layers with finite-width and periodic architectures.
- Investigation of stress singularity fields and stress intensity factors for cracks
Cited in
(3)
This page was built for publication: Delamination in patterned films
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q869276)